The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or

available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

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SECTION 3.3: MOUNTING PROCEDURE ON A PCB FOR BESTCAP®

BestCap® products can be mounted on PCBs by either selectively heating only the capacitor terminals by using a pulsed reflow soldering

station or by using hand soldering. IR Reflow or wave soldering may not be used. The main body of the device should be less than 60ºC at

all times.

PULSED REFLOW SOLDERING

Application data for the ‘Unitek’ pulsed-reflow soldering station.

Controller

Uniflow ‘Pulsed Thermode Control’

Head

Thin-line Reflow Solder Head

Solder paste type

No Clean Flux

Solder composition

63% Sn, 37% Pb

Percent solids

88%

Solder thickness

6 mils

Solder-weld tip size

0.075”

Solder-weld tip force

6 lbs.

Temperature

Time

Pre-heat

130ºC

0 sec.

Rise

440ºC (±10)

2 sec.

Reflow

440ºC (±10)

2 sec.

Cool

165ºC

In both cases, the main body of the BestCap® part should be less than 60ºC at all times.

HAND SOLDERING STATION

Temperature Profile:

Equipment:

Equipment:

Temperature controlled, 50W general

purpose iron

Solder type:

63Sn/37Pb, rosin core wire

Temperature:

400ºC (+20ºC - 100ºC)

Time:

2 to 5 seconds maximum, smaller time (2

sec.) at 420ºC and 5 sec. at 300ºC, overall

it being a time-temperature relationship.

Shorter time, higher temperature is preferred.

Solder Type:

Lead Free, 95Sn/5Ag

Temperature:

430ºC (+20ºC - 100ºC)

Time:

2 to 5 seconds maximum, smaller time (2

sec.) at 450ºC and 5 sec. at 330ºC, overall a

time-temperature relationship. Shorter time,

higher temperature is preferred.

BestCap® Ultra-low ESR

High Power Pulse Supercapacitors

Mounting Procedure on a PCB for BestCap®

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