 2020 Microchip Technology Inc.

DS20006466A-page 3

UCS2113-C

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

Voltage on VDD, VS, and VBUS pins ...................................................................................................................-0.3 to 6V

Pull-Up Voltage (VPULLUP) ..................................................................................................................... -0.3 to VDD + 0.3

Port Power Switch Current ..................................................................................................................... Internally limited

Voltage on any Other Pin to Ground ...................................................................................................-0.3 to VDD + 0.3V

Current on any Other Pin ..................................................................................................................................... ±10 mA

Package Power Dissipation ........................................................................................................................ See Table 1-1

Operating Ambient Temperature Range.................................................................................................-40°C to +105°C

Storage Temperature Range ..................................................................................................................-55°C to +150°C

† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at those or any other conditions above those indicated in the

operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may

affect device reliability.

TABLE 1-1:

POWER DISSIPATION SUMMARY

Board

Package

JC

JA

Derating Factor

Above +25°C

TA < +25°C

Power Rating

TA = +70°C

Power Rating

TA = +85°C

Power Rating

High K

(Note)

20-pin QFN

4x4 mm

6 °C/W

41 °C/W

24.4 mW/°C

2193 mW

1095 mW

729 mW

Low K

(Note)

20-pin QFN

4x4 mm

6 °C/W

60 °C/W

16.67 mW/°C

1498 mW

748 mW

498 mW

Note:

A High-K board uses a thermal via design with the thermal landing soldered to the PCB ground plane with

0.3 mm (12 mil) diameter vias in a 3x3 matrix (9 total) at 0.5 mm (20 mil) pitch. The board is multilayer with

1-ounce internal power and ground planes and 2-ounce copper traces on top and bottom. A Low-K board

is a two-layer board without thermal via design with 2-ounce copper traces on the top and bottom.

TABLE 1-2:

ELECTRICAL SPECIFICATIONS

Electrical Characteristics: Unless otherwise specified, VDD = 4.5V to 5.5V, VS = 2.9V to 5.5V,

VPULLUP = 3V to 5.5V, TA = -40°C to 105°C. All typical values at VDD = VS = 5V, TA = 27°C.

Characteristic

Symbol

Min.

Typ.

Max.

Unit

Conditions

Power and Interrupts - DC

Supply Voltage

VDD

4.5

5

5.5

V

Supply Current in Active

(IDD_ACT + IS1_ACT + IS2_ACT)

IACTIVE

—

700

—

µA

Average current IBUS = 0 mA

Supply Current in Sleep

(IDD_SLEEP + IS1_SLEEP +

IS2_SLEEP)

ISLEEP

—

6

20

µA

Average current VPULLUP  VDD

Power-On Reset

VDD Low Threshold

VDD_TH

—4

4.3

V

VDD voltage increasing (Note 1)

VDD Low Hysteresis

VDD_TH_HYST —

500

600

mV

VDD voltage decreasing

(Note 1)

Note 1:

This parameter is characterized, not 100% tested.

2:

This parameter is ensured by design and not 100% tested.