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M48T08, M48T08Y, M48T18

MAXIMUM RATING

Stressing the device above the rating listed in the

“Absolute Maximum Ratings” table may cause

permanent damage to the device. These are

stress ratings only and operation of the device at

these or any other conditions above those indicat-

ed in the Operating sections of this specification is

not implied. Exposure to Absolute Maximum Rat-

ing conditions for extended periods may affect de-

vice

reliability.

Refer

also

to

the

STMicroelectronics SURE Program and other rel-

evant quality documents.

Table 6. Absolute Maximum Ratings

Note: 1. For DIP package: Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer

than 30 seconds).

2. For SO package, standard (SnPb) lead finish: Reflow at peak temperature of 225°C (total thermal budget not to exceed 180°C for

between 90 to 150 seconds).

3. For SO package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C (total thermal budget not to exceed 245°C

for greater than 30 seconds).

CAUTION: Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up mode.

CAUTION: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.

Symbol

Parameter

Value

Unit

Ambient Operating Temperature

0 to 70

°C

–40 to 85

°C

(1,2,3)

Lead Solder Temperature for 10 seconds

260

°C

Input or Output Voltages

–0.3 to 7

V

Supply Voltage

–0.3 to 7

V

Output Current

20

mA

Power Dissipation

1

W