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January 5, 2009

IDT 89HPES8NT2 Data Sheet

Recommended Operating Temperature

Power Consumption

Typical power is measured under the following conditions: 25°C Ambient, 35% total link usage on all ports, typical voltages defined in Table 14.

Maximum power is measured under the following conditions: 70°C Ambient, 85% total link usage on all ports, maximum voltages defined in

Table 14.

All power measurements assume that the part is mounted on a 10 layer printed circuit board with 0 LFM airflow.

Thermal Considerations

This section describes thermal considerations for the PES8NT2 (19mm2 BCG324 package). The data in Table 15 below contains information that

is relevant to the thermal performance of the PES8NT2 switch.

Note: The parameter θJA(eff) is not the absolute thermal resistance for the package as defined by JEDEC (JESD-51). Because resistance

can vary with the number of board layers, size of the board, and airflow, θJA(eff) is the effective thermal resistance. The values for effective

θJA given above are based on a 10-layer, standard height, full length (4.3”x12.2”) PCIe add-in card.

Grade

Temperature

Commercial

0

°C to +70°C Ambient

Table 13 PES8NT2 Operating Temperatures

Number of

Connected Lanes:

Port-A/Port-C

Core (Watts)

(1.0V supply)

PCIe Digital

(Watts)

(1.0V supply)

PCIe Analog

(Watts)

(1.0V supply)

PCIe Termin-

ation (Watts)

(1.5V supply)

I/O (Watts)

(3.3V supply)

Total (Watts)

Typ

Max

Typ

Max

Typ

Max

Typ

Max

Typ

Max

Typ

Max

4/4

220

390

300

450

100

150

100

210

3

3

0.22

0.43

0.30

0.50

0.10

0.17

0.15

0.33

0.01

0.01

0.78

1.43

Table 14 PES8NT2 Power Consumption

Symbol

Parameter

Value

Units

Conditions

TJ(max)

Junction Temperature

125

oCMaximum

TA(max)

Ambient Temperature

70

oC

Maximum for commercial-rated products

θJA(effective)

Effective Thermal Resistance, Junction-to-Ambient

21.8

oC/W

Zero air flow

15.1

oC/W

1 m/S air flow

13.9

oC/W

2 m/S air flow

θJB

Thermal Resistance, Junction-to-Board

11.4

oC/W

θJC

Thermal Resistance, Junction-to-Case

5.1

oC/W

P

Power Dissipation of the Device

1.43

Watts

Maximum

Table 15 Thermal Specifications for PES8NT2, 19x19mm BCG324 Package