HCTS74MS

FN2143 Rev 2.00

Page 9 of 9

September 1995

Die Characteristics

DIE DIMENSIONS:

89 x 88 mils

2.25 x 2.24mm

METALLIZATION:

Type: SiAl

Metal Thickness: 11k

Å 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å  2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100

m x 100m

4 mils x 4 mils

Metallization Mask Layout

HCTS74MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask

series for the HCTS74 is TA14438A.

R1

VCC

CP1 (3)

S1 (4)

Q1 (5)

Q1 (6)

(8)

(9)

(10) S2

(11) CP2

(12) D2

(13) R2

(1)

(14)

Q2

Q2

D1

(2)

NC

NC

(7)

GND