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DSPIC30F Datasheet(PDF) 185 Page - Microchip Technology

Part # DSPIC30F
Description  General Purpose and Sensor Families High-Performance Digital Signal Controllers
PDF  248 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

DSPIC30F Datasheet(HTML) 185 Page - Microchip Technology

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 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 183
dsPIC30F
23.0 ELECTRICAL CHARACTERISTICS
This section provides an overview of dsPIC30F electrical characteristics. Additional information will be provided in future
revisions of this document as it becomes available.
For detailed information about the dsPIC30F architecture and core, refer to dsPIC30F Family Reference Manual
(DS70046).
Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions above
the parameters indicated in the operation listings of this specification is not implied.
Absolute Maximum Ratings(†)
Ambient temperature under bias............................................................................................................ .-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to V
SS (except VDD and MCLR) ................................................... -0.3V to (VDD + 0.3V)
Voltage on V
DD with respect to VSS ......................................................................................................... -0.3V to +5.5V
Voltage on MCLR with respect to V
SS (Note 1) ......................................................................................... 0V to +13.25V
Total power dissipation (Note 2) ...............................................................................................................................1.0W
Maximum current out of V
SS pin ...........................................................................................................................300 mA
Maximum current into V
DD pin ..............................................................................................................................250 mA
Input clamp current, I
IK (VI < 0 or VI > VDD) ..........................................................................................................±20 mA
Output clamp current, I
OK (VO < 0 or VO > VDD) ...................................................................................................±20 mA
Maximum output current sunk by any I/O pin.......................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .................................................................................................... 25 mA
Maximum current sunk by all ports ....................................................................................................................... 200 mA
Maximum current sourced by all ports .................................................................................................................. 200 mA
Note 1: Power dissipation is calculated as follows:
Pdis = V
DD x {IDD -
∑ IOH} + ∑ {(VDD - VOH) x IOH} + ∑(VOl x IOL)
2: Voltage spikes below V
SS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latchup.
Thus, a series resistor of 50-100
Ω should be used when applying a “low” level to the MCLR/VPP pin, rather
than pulling this pin directly to V
SS.
Note:
The specifications listed in this section are provided for design guidance only. Please refer to the individual
device data sheets for electrical characteristics specific to each device.
†NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note: All peripheral electrical characteristics are specified. For exact peripherals available on specific
devices, please refer the the Family Cross Reference Table.



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