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HIP6004ACB Datasheet(PDF) 10 Page - Renesas Technology Corp

Part # HIP6004ACB
Description  Buck and Synchronous-Rectifier (PWM) Controller and Output Voltage Monitor
PDF  13 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

HIP6004ACB Datasheet(HTML) 10 Page - Renesas Technology Corp

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HIP6004A
FN4417 Rev.2.00
Page 10 of 13
November 2002
Input Capacitor Selection
Use a mix of input bypass capacitors to control the voltage
overshoot across the MOSFETs. Use small ceramic capacitors
for high frequency decoupling and bulk capacitors to supply the
current needed each time Q1 turns on. Place the small ceramic
capacitors physically close to the MOSFETs and between the
drain of Q1 and the source of Q2.
The important parameters for the bulk input capacitor are the
voltage rating and the RMS current rating. For reliable
operation, select the bulk capacitor with voltage and current
ratings above the maximum input voltage and largest RMS
current required by the circuit. The capacitor voltage rating
should be at least 1.25 times greater than the maximum input
voltage and a voltage rating of 1.5 times is a conservative
guideline. The RMS current rating requirement for the input
capacitor of a buck regulator is approximately 1/2 the DC load
current.
For a through hole design, several electrolytic capacitors
(Panasonic HFQ series or Nichicon PL series or Sanyo MV-GX
or equivalent) may be needed. For surface mount designs,
solid tantalum capacitors can be used, but caution must be
exercised with regard to the capacitor surge current rating.
These capacitors must be capable of handling the surge-
current at power-up. The TPS series available from AVX, and
the 593D series from Sprague are both surge current tested.
MOSFET Selection/Considerations
The HIP6004A requires 2 N-Channel power MOSFETs. These
should be selected based upon rDS(ON), gate supply
requirements, and thermal management requirements.
In high-current applications, the MOSFET power dissipation,
package selection and heatsink are the dominant design
factors. The power dissipation includes two loss components;
conduction loss and switching loss. The conduction losses are
the largest component of power dissipation for both the upper
and the lower MOSFETs. These losses are distributed
between the two MOSFETs according to duty factor (see the
equations below). Only the upper MOSFET has switching
losses, since the Schottky rectifier clamps the switching node
before the synchronous rectifier turns on. These equations
assume linear voltage-current transitions and do not
adequately model power loss due the reverse-recovery of the
lower MOSFET’s body diode. The gate-charge losses are
dissipated by the HIP6004A and don't heat the MOSFETs.
However, large gate-charge increases the switching interval,
tSW which increases the upper MOSFET switching losses.
Ensure that both MOSFETs are within their maximum junction
temperature at high ambient temperature by calculating the
temperature rise according to package thermal-resistance
specifications. A separate heatsink may be necessary
depending upon MOSFET power, package type, ambient
temperature and air flow.
Standard-gate MOSFETs are normally recommended for use
with the HIP6004A. However, logic-level gate MOSFETs can
be used under special circumstances. The input voltage, upper
gate drive level, and the MOSFET’s absolute gate-to-source
voltage rating determine whether logic-level MOSFETs are
appropriate.
Figure 9 shows the upper gate drive (BOOT pin) supplied by a
bootstrap circuit from VCC. The boot capacitor, CBOOT
develops a floating supply voltage referenced to the PHASE
pin. This supply is refreshed each cycle to a voltage of VCC
less the boot diode drop (VD) when the lower MOSFET, Q2
turns on. Logic-level MOSFETs can only be used if the
MOSFET’s absolute gate-to-source voltage rating exceeds the
maximum voltage applied to VCC.
Figure 10 shows the upper gate drive supplied by a direct
connection to VCC. This option should only be used in
converter systems where the main input voltage is +5VDC or
less. The peak upper gate-to-source voltage is approximately
VCC less the input supply. For +5V main power and +12VDC
for the bias, the gate-to-source voltage of Q1 is 7V. A logic-
level MOSFET is a good choice for Q1 and a logic-level
MOSFET can be used for Q2 if its absolute gate-to-source
voltage rating exceeds the maximum voltage applied to VCC.
PUPPER = Io2 x rDS(ON) x D +
1
2
Io x VIN x tSW x FS
PLOWER = Io2 x rDS(ON) x (1 - D)
Where: D is the duty cycle = VOUT / VIN,
tSW is the switch ON time, and
FS is the switching frequency.
+12V
PGND
HIP6004A
GND
LGATE
UGATE
PHASE
BOOT
VCC
+5V OR +12V
NOTE:
NOTE:
VG-S VCC
CBOOT
DBOOT
Q1
Q2
+
-
FIGURE 9. UPPER GATE DRIVE - BOOTSTRAP OPTION
VG-S  VCC -VD
D2
+ VD -



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