2N7002AX

Document number: DS36549 Rev. 3 - 3

2 of 5

www.diodes.com

January 2015

© Diodes Incorporated

2N7002AX

Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Units

Drain-Source Voltage

VDSS

60

V

Gate-Source Voltage

VGSS

±20

V

Continuous Drain Current (Note 5) VGS = 10V

Steady

State

TA = +25°C

TA = +85°C

TA = +100°C

ID

180

130

115

mA

Continuous Drain Current (Note 6) VGS = 10V

Steady

State

TA = +25°C

TA = +85°C

TA = +100°C

ID

200

160

140

mA

Maximum Continuous Body Diode Forward Current (Note 6)

IS

0.5

A

Pulsed Drain Current (10µs pulse, duty cycle = 1%)

IDM

700

mA

Thermal Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Units

Total Power Dissipation

(Note 5)

PD

314

mW

(Note 6)

463

Thermal Resistance, Junction to Ambient

(Note 5)

RθJA

400

°C/W

(Note 6)

272

Thermal Resistance, Junction to Case

(Note 6)

RθJC

100

Operating and Storage Temperature Range

TJ, TSTG

-55 to +150

°C

Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 7)

Drain-Source Breakdown Voltage

BVDSS

60

⎯

⎯

V

VGS = 0V, ID = 250µA

Zero Gate Voltage Drain Current

IDSS

⎯

⎯

1.0

µA

VDS = 60V, VGS = 0V

Gate-Body Leakage

IGSS

⎯

⎯

±10

µA

VGS = ±20V, VDS = 0V

ON CHARACTERISTICS (Note 7)

Gate Threshold Voltage

VGS(th)

1.2

⎯

2.0

V

VDS = VGS, ID = 250µA

Static Drain-Source On-Resistance

RDS(ON)

⎯

⎯

6

Ω

VGS = 5V, ID = 0.115A

Forward Transconductance

gFS

80

⎯

⎯

mS

VDS = 10V, ID = 0.115A

DYNAMIC CHARACTERISTICS (Note 8)

Input Capacitance

Ciss

⎯

26.5

⎯

pF

VDS = 25V, VGS = 0V, f = 1.0MHz

Output Capacitance

Coss

⎯

2.2

⎯

pF

Reverse Transfer Capacitance

Crss

⎯

1.7

⎯

pF

SWITCHING CHARACTERISTICS (Note 8)

Turn-On Delay Time

tD(ON)

⎯

2.3

⎯

ns

VDD = 30V, ID = 0.115A, RL = 150Ω,

VGEN = 10V, RGEN = 25Ω

Turn-Off Delay Time

tD(OFF)

⎯

10.8

⎯

ns

Notes:

5. Device mounted on FR-4 PCB, with minimum recommended pad layout

6. Device mounted on 1” x 1” FR-4 PCB with high coverage 2oz. Copper, single sided.

7. Short duration pulse test used to minimize self-heating effect.

8. Guaranteed by design. Not subject to product testing.