Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

2FAM-C5R - Integrated Passive & Active Device using CSP

Block Diagram

GND

R1:

10 OHMS

R2:

10 OHMS

EXT1

INT1

EXT2

INT2

The CSP device block diagram below includes the pin names and basic electrical

connections associated with each channel.

Please consult the “Bourns Design

Guide Using CSP” for notes on PCB

design and SMT Processing.

PCB Design and SMT Processing

How to Order

Thinfilm

Model

Chipscale

No. of Solder Bumps

Packaging Option

R = Tape and Reel

Packaged 3000 pcs. / 7 ” reel

Terminations

LF = Sn/Ag/Cu (lead free)

Blank = Sn/Pb