R34DS0022EU0102 Rev.1.02

Page 8

Feb 15, 2023

ISL73847SEH Datasheet

3.

Specifications

3.1

Absolute Maximum Ratings

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such

conditions can adversely impact product reliability and result in failures not covered by warranty.

3.2

ESD Ratings

3.3

Thermal Information

Parameter

Minimum

Maximum

Unit

VDD, ISENSx, EN, PG

GND - 0.3

GND + 20

V

VDD, EN, PG[1]

1. Tested under a heavy ion environment at LET = 86MeV•cm2/mg at 125°C (TC) for Single Event Burnout (SEB). See the SEE Test Report

for more details.

GND - 0.3

GND + 20

V

ISENSx[1]

GND - 0.3

GND + 10

V

VCC

GND - 0.3

6.5

V

VCC[1]

GND - 0.3

5.3

V

VREF, DROOP, VFBx, FS, COMP, SLOPE, FLT, IMON

GND - 0.3

VCC + 0.3

V

PWMx, SYNC-I, SYNC-O

GND - 0.3

VCC + 0.3

V

Differential Voltage Across Current Sense Inputs

V(ISENx+) - V(ISENx-)[2]

2. Maximum current through anti-parallel diodes show be ≤10mA.

- 0.3

+ 0.3

V

ESD Model/Test

Rating

Unit

Human Body Model (Tested per MIL-STD-883 TM3015.7)

2

kV

Charged Device Model (Tested per JS-002-2018)

750

V

Latch-Up (Tested per JESD78E; Class 2, Level A)

±100

mA

Package Description

Thermal Resistance (Typical)

θJA(°C/W)[1]

1. θJA is measured with the component mounted on a high-effective thermal conductivity test board (two buried 1 oz copper planes) using

direct attach features with package base mounted to PCB thermal land (with thermal vias below) with Epoxy (10 mils thick with a k of

1W/m-K). See TB379.

θJC(°C/W)[2]

2. For θJC, the case temperature location is the center of the package underside.

24 Lead CDFP Package

23

1.7

Parameter

Minimum

Maximum

Unit

Maximum Junction Temperature

-

+150

°C

Storage Temperature Range

-65

+150

°C