| Electronic Components Datasheet Search |
|
ISL80083 Datasheet(PDF) 21 Page - Renesas Technology Corp |
|
|
|||||||||||||||||||||||||||||
ISL80083 Datasheet(HTML) 21 Page - Renesas Technology Corp |
|
21 / 21 page ![]() ISL80083 FN7886 Rev 1.00 Page 21 of 21 May 15, 2013 Package Outline Drawing W5x5.25B 5X5 ARRAY 25 BALL WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) Rev 2, 12/11 BOTTOM VIEW SIDE VIEW TYPICAL RECOMMENDED LAND PATTERN TOP VIEW NSMD refers to Non-Solder Mask Defined pad design per Dimension and tolerance per ASMEY 14.5M-1994, 3. 2. All dimensions are in millimeters. 1. NOTES: and JESD 95-1 SPP-010. Intersil Tech Brief TB451 located at: NSMD PACKAGE 0.10 (4X) X Y Z 0.05 Z SEATING PLANE 3 PIN 1 (A1 CORNER) 0.25±0.03 0.19±0.03 0.55 MAX 0.305±0.025 2.11±0.03 2.13±0.03 1.60 1.60 0.40 A B 5 4 3 C D 12 E 0.40 25x 0.225±0.03 0.25 0.225 0.40 0.10 Z X Y 0.05 Z OUTLINE http://www.intersil.com/data/tb/tb451.pdf. 0.265 0.254 |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |