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ST72361 Datasheet(PDF) 209 Page - STMicroelectronics

Part # ST72361
Description  8-BIT MCU WITH FLASH OR ROM, 10-BIT ADC, 5 TIMERS, SPI, 2x LINSCI
PDF  224 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST72361 Datasheet(HTML) 209 Page - STMicroelectronics

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Figure 126. 64-Pin Low Profile Quad Flat Package (10 x10)
13.2 THERMAL CHARACTERISTICS
Notes:
1. The maximum power dissipation is obtained from the formula PD = (TJ - TA) / RthJA. The power dissipation of an appli-
cation can be defined by the user with the formula: PD = PINT + PPORT where PINT is the chip internal power (IDD x VDD)
and PPORT is the port power dissipation depending on the ports used in the application.
2. The maximum chip-junction temperature is based on technology characteristics.
13.3 SOLDERING AND GLUEABILITY INFORMATION
In order to meet environmental requirements, ST
offers these devices in ECOPACKTM packages.
These packages have a lead-free second level in-
terconnect. The category of second level intercon-
nect is marked on the package and on the inner
box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to solder-
ing conditions are also marked on the inner box la-
bel. ECOPACK is an ST trademark. ECOPACKTM
specifications are available at www.st.com.
Dim.
mm
inches
Min
Typ
Max
Min
Typ
Max
A
1.60
0.063
A1
0.05
0.15 0.002
0.006
A2
1.35
1.40
1.45 0.053 0.055 0.057
b
0.17
0.22
0.27 0.007 0.009 0.011
c
0.09
0.20 0.004
0.008
D
12.00
0.472
D1
10.00
0.394
E
12.00
0.472
E1
10.00
0.394
e
0.50
0.020
θ
0°
3.5°
7°
0°
3.5°
7°
L
0.45
0.60
0.75 0.018 0.024 0.030
L1
1.00
0.039
Number of Pins
N
64
A
A2
A1
c
θ
L1
L
E
E1
D
D1
e
b
Symbol
Ratings
Value
Unit
RthJA
Package thermal resistance (junction to ambient)
LQFP64
LQFP44
LQFP32
60
52
70
°C/W
PD
Power dissipation1)
500
mW
TJmax
Maximum junction temperature2)
150
°C



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