Nexperia

PSC1065H

650 V, 10 A SiC Schottky diode in DPAK R2P

8. Soldering

SOT8017

Footprint information for reflow soldering of DPAK R2P (SOT8017) package

sot8017_fr

occupied area

solder paste

solder resist

solder land

Issue date

Dimensions in mm

21-11-01

21-11-03

1.2

2.29

1.4

2.68

1.6

1.9

6.48

6.0

5.8

6.4

2.6 2.4 2.2

2.2

6.2

1.0 (14x)

2.31

0.25

1.7 (14x)

0.25

1.55

3.15

6.6

11.3

7.04

recommended stencil thickness: 0.125 mm

Fig. 2. Reflow soldering footprint for DPAK R2P (SOT8017)

PSC1065H_SDS

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Nexperia B.V. 2023. All rights reserved

Short data sheet

26 April 2023

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