MPVZ12

Sensors

Freescale Semiconductor

5

Figure 4. Cross-Sectional Diagram (not to scale)

Figure 4 illustrates the differential or gauge configuration

in the basic chip carrier (applicable to cases 482, 1560 and

1735). A gel isolates the die surface and wire bonds from the

environment, while allowing the pressure signal to be

transmitted to the silicon diaphragm.

Operating characteristics, internal reliability and

qualification tests are based on use of dry clean air as the

pressure media. Media other than dry clean air may have

adverse effects on sensor performance and long term

reliability. Contact the factory for information regarding media

compatibility in your application.

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing gel which isolates

the die from the environment. The Freescale MPVZ12 series

is designed to operate with positive differential pressure

applied, P1 > P2.

The Pressure (P1) side may be identified by using the

following table

Gel Die Coat

Wire Bond

Die

P1

Stainless

Steel Cap

Thermoplastic

Case

Die Bond

Differential Sensing

Element

P2

Lead Frame

Part Number

Case Type

Pressure (P1) Side

Identifier

MPVZ12GC6U

482A

98ASB17757C

Top with Port Attached

MPVZ12GC7U

482C

98ASB17759C

Top with Port Attached

MPVZ12GW6U

1735

98ASA10686D

Top with Port Attached

MPVZ12GW7U

1560

98ASA10611D

Top with Port Attached