Nexperia

BAS16LS

High-speed switching diode

9. Thermal characteristics

Table 6. Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

[1]

-

-

360

K/W

Rth(j-a)

thermal resistance from

junction to ambient

in free air

[2]

-

-

195

K/W

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), 70 μm single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 Printed-Circuit Board (PCB), 70 μm single-sided copper, tin-plated mounting pad for cathode 1cm2.

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10

1

102

103

Zth(j-a)

(K/W)

10-1

10-5

10

10-2

10-4

102

10-1

tp (s)

10-3

103

1

duty cycle = 1

0.01

0.02

0.05

0.10

0.20

0.33

0.50

0.75

0

0.25

FR4 PCB, 70 μm single sided copper standard footprint

Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

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10

1

102

103

Zth(j-a)

(K/W)

10-1

10-5

10

10-2

10-4

102

10-1

tp (s)

10-3

103

1

duty cycle = 1

0.05

0.10

0.33

0.50

0.75

0.25

0.01

0.20

0

0.02

FR4 PCB, 70 μm single sided copper, mounting pad for cathode 1 cm2

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

BAS16LS

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Product data sheet

9 February 2021

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