AD8392A

Rev. 0 | Page 4 of 12

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

±13 V (+26 V)

Power Dissipation

See Figure 3

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

for the device soldered in the circuit board for surface-mount

packages.

Table 3.

Package Type

Unit

LFCSP-32 (CP)

27.27

°C/W

TSSOP-28/EP (RE)

35.33

°C/W

Maximum Power Dissipation

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

addition, more metal directly in contact with the package leads

from metal traces, through holes, ground, and power planes

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the LFCSP-32 and

TSSOP-28/EP packages on a JEDEC standard 4-layer board.

0

1

2

3

4

5

6

7

–40 –30 –20 –10

0

10

20

30

40

50

60

70

80

90

TEMPERATURE (°C)

LFCSP-32

TSSOP-28/EP

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

See the Thermal Considerations section for additional thermal

design guidance.

ESD CAUTION