2004 Nov 22

4

NXP Semiconductors

Product data sheet

PNP switching transistor

PXT4403

THERMAL CHARACTERISTICS

Notes

1.

Device mounted on a printed-circuit board, single-sided copper, tin-plated and standard footprint.

2.

Device mounted on a printed-circuit board, single-sided copper, tin-plated and mounting pad for collector 1 cm2.

3.

Device mounted on a printed-circuit board, single-sided copper, tin-plated and mounting pad for collector 6 cm2.

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

Rth(j-a)

thermal resistance from junction to

ambient

in free air

note 1

250

K/W

note 2

156

K/W

note 3

113

K/W

Rth(j-s)

thermal resistance from junction to

soldering point

30

K/W

006aaa235

10−5

10

10−2

10−4

102

10−1

tp (s)

10−3

103

1

102

10

103

Zth

(K/W)

1

(6)

(7)

(8)

(9)

(10)

(1)

(5)

(4)

(3)

(2)

Fig.3 Transient thermal impedance as a function of pulse time; typical values.

(1)

δ = 1.

(2)

δ = 0.75.

(3)

δ = 0.5.

(4)

δ = 0.33.

(5)

δ = 0.2.

(6)

δ = 0.1.

(7)

δ = 0.05.

(8)

δ = 0.02.

(9)

δ = 0.01.

(10)

δ = 0.

Mounted on FR4 printed-circuit board; standard footprint.