ADIS16203SLASHPCBZ datasheet(25/28 Pages) AD

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ADIS16203

Rev. 0 | Page 25 of 28

POWER-ON RESET OPERATION

An internal power-on reset (POR) is implemented internally to

the ADIS16203. For VDD below 2.35 V, the internal POR holds the

ADIS16203 in reset. As VDD rises above 2.35 V, an internal timer

times out for typically 130 ms before the part is released from reset.

The user must ensure that the power supply has reached a stable

3.0 V minimum level by this time. Likewise, on power-down, the

internal POR holds the ADIS16203 in reset until VDD drops below

2.35 V. Figure 33 illustrates the operation of the internal POR in detail.

VDD

POR

130ms TYP

2.35V TYP

Figure 33. Internal Power-On Reset Operation

Once the power sequence is complete, the self-test sequence follows.

This sequence takes approximately 14 ms in high performance mode

and approximately 36 ms in normal mode. The power-up self-test

can be disabled using Bit 10 in the MSC_CTRL register if the start

time is a critical consideration.

SECOND-LEVEL ASSEMBLY

The ADIS16203 can be attached to the second-level assembly board

using SN63 (or equivalent) or lead-free solder. Figure 34 and Table 24

provide acceptable solder reflow profiles for each solder type. Note

that these profiles may not be the optimum profile for the user’s

application. In no case should 260°C be exceeded. It is recommended

that the user develop a reflow profile based upon the specific application.

In general, the lowest peak temperature and shortest dwell time above

the melt temperature of the solder result in less shock and stress to

the product. In addition, evaluating the cooling rate and peak tem-

perature can result in a more reliable assembly.

t25°C TO PEAK

PREHEAT

CRITICAL ZONE

TL TO TP

TIME

RAMP-DOWN

RAMP-UP

TSMIN

TSMAX

Figure 34. Acceptable Solder Reflow Profiles

Table 24.

Condition

Profile Feature

Sn63/Pb37

Pb-Free

Average Ramp Rate (TL to TP)

3°C/sec max

Preheat

Minimum Temperature

(TSMIN)

100°C

150°C

Maximum Temperature (TSMAX)

150°C

200°C

Time (TSMIN to TSMAX) (ts)

60 sec to

120 sec

60 sec to

150 sec

TSMAX to TL

Ramp-Up Rate

3°C/sec

Time Maintained Above

Liquidous (TL)

Liquidous Temperature (TL)

183°C

217°C

Time (tL)

60 sec to

150 sec

60 sec to

150 sec

Peak Temperature (TP)

240°C +

0°C/–5°C

260°C +

0°C/–5°C

Time Within 5°C of Actual

Peak Temperature (tp)

10 sec to

30 sec

20 sec to

40 sec

Ramp-Down Rate

6°C/sec max

Time 25°C to Peak Temperature

6 minutes

max

8 minutes

max

EXAMPLE PAD LAYOUT

1.178 BSC

(8 PLCS)

0.500 BSC

(16 PLCS)

0.670 BSC

127 BSC

6 PLCS)

(12 PLCS)

7.873 BSC

(2 PLCS)

Figure 35. Example Pad Layout

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