STM32H7 datasheet(115/357 Pages) STMICROELECTRONICS

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DS12110 Rev 10

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STM32H742xI/G STM32H743xI/G

Electrical characteristics (rev Y)

320

I/O system current consumption

The current consumption of the I/O system has two components: static and dynamic.

I/O static current consumption

All the I/Os used as inputs with pull-up or pull-down generate a current consumption when

the pin is externally held low. The value of this current consumption can be simply computed

by using the pull-up/pull-down resistors values given in Table 60: I/O static characteristics.

For the output pins, any internal or external pull-up or pull-down, and any external load must

also be considered to estimate the current consumption.

An additional I/O current consumption is due to I/Os configured as inputs if an intermediate

voltage level is externally applied. This current consumption is caused by the input Schmitt

trigger circuits used to discriminate the input value. Unless this specific configuration is

required by the application, this supply current consumption can be avoided by configuring

these I/Os in analog mode. This is notably the case of ADC input pins which should be

configured as analog inputs.

Caution:

Any floating input pin can also settle to an intermediate voltage level or switch inadvertently,

as a result of external electromagnetic noise. To avoid a current consumption related to

floating pins, they must either be configured in analog mode, or forced internally to a definite

digital value. This can be done either by using pull-up/down resistors or by configuring the

pins in output mode.

I/O dynamic current consumption

In addition to the internal peripheral current consumption (see Table 39: Peripheral current

consumption in Run mode), the I/Os used by an application also contribute to the current

consumption. When an I/O pin switches, it uses the current from the MCU supply voltage to

supply the I/O pin circuitry and to charge/discharge the internal or external capacitive load

connected to the pin:

where

ISW is the current sunk by a switching I/O to charge/discharge the capacitive load

VDDx is the MCU supply voltage

fSW is the I/O switching frequency

CL is the total capacitance seen by the I/O pin: C = CINT+ CEXT

Table 38. Typical and maximum current consumption in VBAT mode

Symbol

Parameter

Conditions

Typ(1)

Max (3 V)

Unit

Backup

SRAM

RTC &

LSE

1.2 V

2 V

3 V

3.4 V

TJ =

25°C

TJ =

85°C

TJ =

105°C

TJ =

125°C

IDD

(VBAT)

Supply

current in

standby

mode

OFF

0.024

0.035 0.062 0.096 0.5(1) 4.1(1)

10(1)

24(1)

µA

OFF

1.4

1.6

1.8

4.4(1)

22(1)

48(1)

87(1)

OFF

0.24

0.45

0.62

0.73

1.97

2.37

2.57

2.77

1. Guaranteed by characterization results.

ISW

VDDx fSW CL

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