STM32H7 datasheet(321/357 Pages) STMICROELECTRONICS

321 / 357 page

DS12110 Rev 10

321/357

STM32H742xI/G STM32H743xI/G

Package information

348

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at www.st.com. ECOPACK

is an ST trademark

8.1

Device marking

Refer to technical note “Reference device marking schematics for STM32 microcontrollers

and microprocessors” (TN1433) available on www.st.com, for the location of pin 1 / ball A1

as well as the location and orientation of the marking areas versus pin 1 / ball A1.

Parts marked as “ES”, “E” or accompanied by an engineering sample notification letter, are

not yet qualified and therefore not approved for use in production. ST is not responsible for

any consequences resulting from such use. In no event will ST be liable for the customer

using any of these engineering samples in production. ST’s Quality department must be

contacted prior to any decision to use these engineering samples to run a qualification

activity.

A WLCSP simplified marking example (if any) is provided in the corresponding package

information subsection.

8.2

LQFP100 package information (1L)

This LQFP is 100 lead, 14 x 14 mm low-profile quad flat package.

Note:

See list of notes in the notes section.

STM32H7 Datasheet(PDF) 321 Page - STMicroelectronics