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STM32H7 Datasheet(PDF) 333 Page - STMicroelectronics |
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STM32H7 Datasheet(HTML) 333 Page - STMicroelectronics |
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333 / 357 page  DS12110 Rev 10 333/357 STM32H742xI/G STM32H743xI/G Package information 348 Figure 127. UFBGA169 - Footprint example Note: Non-solder mask defined (NSMD) pads are recommended. Note: 4 to 6 mils solder paste screen printing process. eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 223. UFBGA169 - Example of PCB design rules (0.5 mm pitch BGA) Dimension Values Pitch 0.5 mm Dpad 0.27 mm Dsm 0.35 mm typ. (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter. Table 222. UFBGA169 - Mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. BGA_WLCSP_FT_V1 Dsm Dpad |
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