STM32H7 datasheet(345/357 Pages) STMICROELECTRONICS

Part #	STM32H7

Description	32-bit Arm® Cortex®-M7 480MHz MCUs, up to 2MB flash, up to 1MB RAM, 46 com. and analog interfaces

PDF	357 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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345 / 357 page

DS12110 Rev 10

345/357

STM32H742xI/G STM32H743xI/G

Package information

348

Figure 135. TFBGA240+25 - Footprint example

8.10

Thermal characteristics

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max × ΘJA)

Where:

•

TA max is the maximum ambient temperature in ° C,

•ΘJA is the package junction-to-ambient thermal resistance, in ° C/W,

•

PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

•

PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Table 229. TFBGA240+25 - Example of PCB design rules

Dimension

Values

Pitch

0.8 mm

Dpad

0.300 mm

Dsm

0.400 mm typ. (depends on the soldermask

registration tolerance)

Stencil opening

0.400 mm

Stencil thickness

0.100 mm

BGA_WLCSP_FT_V1

Dsm

Dpad

STM32H7 Datasheet(PDF) 345 Page - STMicroelectronics

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