LT6204IGN datasheet(19/24 Pages) LINER

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LT6202/LT6203/LT6204

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PACKAGE DESCRIPTIO

GN16 (SSOP) 0502

.229 – .244

(5.817 – 6.198)

.150 – .157**

(3.810 – 3.988)

16 15 14 13

.189 – .196*

(4.801 – 4.978)

12 11 10 9

.016 – .050

(0.406 – 1.270)

.015

± .004

(0.38

± 0.10)

× 45°

° – 8° TYP

.007 – .0098

(0.178 – 0.249)

.053 – .068

(1.351 – 1.727)

.008 – .012

(0.203 – 0.305)

.004 – .0098

(0.102 – 0.249)

.0250

(0.635)

BSC

.009

(0.229)

REF

.254 MIN

RECOMMENDED SOLDER PAD LAYOUT

.150 – .165

.0250 TYP

.0165

±.0015

.045

±.005

*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE

**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE

INCHES

(MILLIMETERS)

NOTE:

1. CONTROLLING DIMENSION: INCHES

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

GN Package

16-Lead Plastic SSOP (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1641)

DD Package

8-Lead Plastic DFN (3mm

× 3mm)

(Reference LTC DWG # 05-08-1698)

3.00

±0.10

(4 SIDES)

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)

2. ALL DIMENSIONS ARE IN MILLIMETERS

3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

4. EXPOSED PAD SHALL BE SOLDER PLATED

0.38

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65

± 0.10

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

2.38

±0.10

(2 SIDES)

PIN 1

TOP MARK

0.200 REF

0.00 – 0.05

(DD8) DFN 0203

0.28

± 0.05

2.38

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65

±0.05

(2 SIDES)

2.15

±0.05

0.50

BSC

0.675

±0.05

3.5

±0.05

PACKAGE

OUTLINE

0.28

± 0.05

0.50 BSC

LT6204IGN Datasheet(PDF) 19 Page - Linear Technology

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