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XECOM
(7)
XE5692H
XE5692H Surface-Mount Soldering Instructions
The XE5692H is subject to damage if over-exposed to heat during solder reflow operations. Following
the soldering instructions below will ensure that the process of soldering the module to the board does not
damage the modem.
Maximum Temperature
220O C
Maximum Time at 220O C
20 Seconds
Maximum Time above Eutectic (180O C)
90 Seconds
Maximum Preheat Dwell Time
180 Seconds
Maximum Recommended Solder Temperature Profile
220O C
180O C
150O C
-20 sec-
------------------------------180 sec max-------------------------
max
----- 90 sec max -----