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LZP-W0MN00 Datasheet(PDF) 5 Page - ams AG

Part # LZP-W0MN00
Description  LZP Emitter on 4-Channel Connectorized MCPCB For emitter specification, please refer to the emitter datasheet LZP-00MN00.
PDF  14 Pages
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Manufacturer  AMSCO [ams AG]
Direct Link  http://www.ams.com
Logo AMSCO - ams AG

LZP-W0MN00 Datasheet(HTML) 5 Page - ams AG

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LZP-W0MN00
DATASHEET
DATASHEET
5 | Version 1.2 | 2022-05-17
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The following diagrams describe the recommended mounting structure:
─ Thermal interface material between MCPCB and Heat Sink
─ Plastic washers between M3 or #4-40 screw heads and MCPCB.
Please note that the following diagrams use one of our MCPCB product as a general depiction of
the mounting structure. Refer to “Dimensional Drawing” section in this datasheet for the exact form
factor of the product in this datasheet.
Mounting structure (exploded view)
Mounting structure (normal view)
Thermal interface material
A good thermal design requires an efficient heat transfer from the MCPCB to the heat sink. In order
to minimize air gaps in between the MCPCB and the heat sink, it is common practice to use thermal
interface materials such as thermal pastes, thermal pads, phase change materials and thermal
epoxies. Each material has its pros and cons depending on the design. Thermal interface materials
are most efficient when the mating surfaces of the MCPCB and the heat sink are flat and smooth.
Rough and uneven surfaces may cause gaps with higher thermal resistances, increasing the overall
thermal resistance of this interface. It is critical that the thermal resistance of the interface is low,
allowing for an efficient heat transfer to the heat sink and keeping MCPCB temperatures low.



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