CGH40180PP

7

Rev. 3.3, 2022-11-17

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The information in this document is subject to change without notice.

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Thermal Resistance as a Function of Pulse Width

Time (seconds)

0.6

0.7

0.8

0.9

1.0

Heating Curve for 2x28.8mm GaN HEMT in 440199 Package at 4W/mm

0.0

0.1

0.2

0.3

0.4

0.5

1.00E-08

1.00E-07

1.00E-06

1.00E-05

1.00E-04

1.00E-03

1.00E-02

1.00E-01

1.00E+00

Time (seconds)

Notes:

1 VDD = 28 V, IDQ = 2.0 A In the 440199 package

2 Optimized for power, gain, PSAT and PAE

3 When using this device at low frequency, series resistors should be used to

maintain amplifier stability

Simulated Source and Load Impedances

Frequency (MHz)

Z Source

Z Load

500

2.85 + j1.99

5.27 + j0.68

1000

0.8 + j0.42

4.91 + j0.36

1500

0.84 - j1.69

4.65 - j0.24

2000

0.88 - j3.05

2.8 - j1.05

2500

1.08 - j4.5

3.1 - j2.47

3000

1.25 - j6.06

3.1 - j4.01

D1

Z Source 1

Z Load 1

G1

S

G2

Z Source 2

Z Load 2

D2

Note:

1 This heating curve assumes zero power dissipation during the “off” portion of the duty cycle

1 This data is for transient power dissipation at 224 W, Duty Cycle = 20%