CGHV60040D

3

Rev. 1.3, 2022-12-12

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The information in this document is subject to change without notice.

4600 Silicon Drive | Durham, NC 27703 | Tel: +1.919.313.5300

DIE Dimensions (units in microns)

Assembly Notes:

•

Recommended solder is AuSn (80/20) solder. Refer to Wolfspeed’s website for the Eutectic Die

Bond Procedure application note at https://www.wolfspeed.com/rf/document-library

•

Vacuum collet is the preferred method of pick-up.

•

The backside of the die is the Source (ground) contact.

•

Die back side gold plating is 5 microns thick minimum.

•

Thermosonic ball or wedge bonding are the preferred connection methods.

•

Gold wire must be used for connections.

•

Use the die label (XX-YY) for correct orientation.

Overall die size 1800 x 820 (+0/-50) microns, die thickness 100 microns.

All Gate and Drain pads must be wire bonded for electrical connection.

Pad

Size (microns)

Drain

464 x 156

Gate

464 x 156

Interconnect

156 x 152

Electrostatic Discharge (ESD) Classifications

Parameter

Symbol

Class

Classification Level

Test Methodology

Human Body Model

HBM

TBD

ANSI/ESDA/JEDEC JS-001 Table 3

JEDEC JESD22 A114-D