SFH 305

DATASHEET

DATASHEET

12 | Version 1.4 | 2023-06-06

TTW Soldering

IEC-61760-1 TTW

0

0

s

OHA04645

50

100

150

200

250

300

t

T

˚C

235 ˚C - 260 ˚C

First wave

20

40

60

80

100

120

140

160

180

200

220

240

Second wave

10 s max., max. contact time 5 s per wave

Preheating

T

∆

100 ˚C

120 ˚C

130 ˚C

Typical

Cooling

ca. 3.5 K/s typical

ca. 2 K/s

ca. 5 K/s

Continuous line: typical process

Dotted line: process limits

< 150 K

Notes

Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. 

Metal filled materials can be affected by environments that contain traces of aggressive substances. There-

fore, we recommend that customers minimize device exposure to aggressive substances during storage,

production, and use. Devices that showed visible discoloration when tested using the described tests above

did show no performance deviations within failure limits during the stated test duration. Respective failure

limits are described in the IEC60810.

For further application related information please visit https://ams-osram.com/support/application-notes