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UPD6P4BGS Datasheet(PDF) 21 Page - Renesas Technology Corp

Part # UPD6P4BGS
Description  MOS INTEGRATED CIRCUIT
PDF  34 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

UPD6P4BGS Datasheet(HTML) 21 Page - Renesas Technology Corp

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Data Sheet U13594EJ2V1DS00
19
µPD6P4B
AC Programming Characteristics (TA = 25
°C, VDD = 6.0 ±0.25 V, VPP = 12.5 ±0.3 V)
Parameter
Symbol
Note1
Test Conditions
MIN.
TYP.
MAX.
Unit
Address setup timeNote 2 (vs. MD0
↓)tAS
tAS
2
µs
MD1 setup time (vs. MD0
↓)tM1S
tOES
2
µs
Data setup time (vs. MD0
↓)tDS
tDS
2
µs
Address hold timeNote 2 (vs. MD0
↑)tAH
tAH
2
µs
Data hold time (vs. MD0
↑)tDH
tDH
2
µs
MD0
↑→ data output float delay time
tDF
tDF
0
130
ns
VPP setup time (vs. MD3
↑)tVPS
tVPS
2
µs
VDD setup time (vs. MD3
↑)tVDS
tVCS
2
µs
Initial program pulse width
tPW
tPW
0.95
1.0
1.05
ms
Additional program pulse width
tOPW
tOPW
0.95
21.0
ms
MD0 setup time (vs. MD1
↑)tMOS
tCES
2
µs
MD0
↓→ data output delay time
tDV
tDV
MD0 = MD1 = VIL
1
µs
MD1 hold time (vs. MD0
↑)tM1H
tOEH
tM1H+tM1R
≥ 50
µs2
µs
MD1 recovery time (vs. MD0
↓)tM1R
tOR
2
µs
Program counter reset time
tPCR
–10
µs
CLK input high-, low-level width
tXH, tXL
–
0.125
µs
CLK input frequency
fX
–
8
MHz
Initial mode set time
tI
–2
µs
MD3 setup time (vs. MD1
↑)tM3S
–2
µs
MD3 hold time (vs. MD1
↓)tM3H
–2
µs
MD3 setup time (vs. MD0
↓)tM3SR
–
When program memory is read
2
µs
AddressNote 2
→ data output delay time
tOAD
tACC
When program memory is read
2
µs
AddressNote 2
→ data output hold time
tHAD
tOH
When program memory is read
0
130
ns
MD3 hold time (vs. MD0
↑)tM3HR
–
When program memory is read
2
µs
MD3
↓→ data output float delay time
tDFR
–
When program memory is read
2
µs
Reset setup time
tRES
–10
µs
Oscillation stabilization wait timeNote 3
tWAIT
–2
ms
Notes 1. Equivalent symbol of the corresponding
µPD27C256A (The µPD27C256A is a maintenance product.)
2. The internal address signal is incremented at the falling edge of the third clock of CLK.
3. Connect a 4 MHz ceramic resonator between the XIN and XOUT pins.



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