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ICP0349P Datasheet(PDF) 13 Page - Microchip Technology

Part # ICP0349P
Description  2.7-3.5GHz 70W GaN PA MMIC
PDF  16 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

ICP0349P Datasheet(HTML) 13 Page - Microchip Technology

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2.7-3.5GHz 70W GaN PA MMIC
ICP0349P
Datasheet Rev B
© 2023 Microchip Technology Inc.
and its subsidiaries
Page 13
Evaluation Board
Value
Details
Qty
Manufacturer Part No.
J1, J2
n/a
HLT End Launch connector
2
CPSM-KF-01A
J3. J4
n/a
Amphenol BNC Panel Jack
2
112639
J5, J6
n/a
9way Dsub connector
2
Various
C1, C2
10uF
10uF Capacitor 1206
2
Various
C31 - C34
10uF
10uF Capacitor 0603
4
Various
C3, C6, C11, C15,
C19, C23, C27, C30
1uF
1uF Capacitor 0402, X8R, 50V
10
Various
C4, C7, C10, C14,C18,
C22, C26, C29
1nF
1nF Capacitor 0402, C0G, 50V
8
Various
C35 - C38
100pF
100pF Capacitor 0402, C0G, 50V
4
Various
C5, C8, C9, C13, C17,
C21, C25, C28
4.7pF
4.7pF Capacitor 0402, C0G, 50V
8
Various
L1 - L4
5.6nH
5.6nH Inductor 0402
4
Various
R7 - R10
10ohm
10ohm Resistor 0402
4
Various
R20, R22, R24, R26
0ohm
0ohm Resistor 0402 (link)
6
Various
R1, R2, R3, R4, R5, R6
0ohm
0ohm Resistor 2010 (link)
6
Various
Evaluation board construction:
Board Size: 56mm X 75mm
PCB Material: RO4350 thickness 10mil
Recommended Copper Weight of 1oz
Via size 0.24mm plated to >50um thickness
Vias below the package must be Cu filled
Baseplate: Solid copper 56mm X 75mm x 9.9mm
Thickness



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