Electronic Components Datasheet Search
  New Zealand  ▼
ALLDATASHEET.CO.NZ

X  

112C-TXAR-R02 Datasheet(PDF) 4 Page - ATTEND Technology Inc.

Part # 112C-TXAR-R02
Description  This specification covers the requirements for product performance, test methods and quality assurance provisions of 112C-TXAR-R02.
PDF  7 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  ATTEND [ATTEND Technology Inc.]
Direct Link  https://www.attend.com.tw/index.php
Logo ATTEND - ATTEND Technology Inc.

112C-TXAR-R02 Datasheet(HTML) 4 Page - ATTEND Technology Inc.

  112C-TXAR-R02 Datasheet HTML 1Page - ATTEND Technology Inc. 112C-TXAR-R02 Datasheet HTML 2Page - ATTEND Technology Inc. 112C-TXAR-R02 Datasheet HTML 3Page - ATTEND Technology Inc. 112C-TXAR-R02 Datasheet HTML 4Page - ATTEND Technology Inc. 112C-TXAR-R02 Datasheet HTML 5Page - ATTEND Technology Inc. 112C-TXAR-R02 Datasheet HTML 6Page - ATTEND Technology Inc. 112C-TXAR-R02 Datasheet HTML 7Page - ATTEND Technology Inc.  
Zoom Inzoom in Zoom Outzoom out
 4 / 7 page
background image
SERIES:
112C-TXAR-R02
FILE:
112C-TXAR-R02_spec
SPECIFICATION AND PERFORMANCE
DATE:
2012/10/25
The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有;非經同意,不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。
‐4 ‐ 
100MΩ Min.
Humidity
1.Appearance : No
evidence of physical
damage.
2. Contact resistance:
100mΩ Max.
3.Insulation resistance:
100MΩ Min.
The specimens shall be placed in a No
evidence of chamber and subjected to a
relative humidity of 90% to 95% and a
temperature of 40±2℃ for 96 hours, then
placed in ambient temperature for more
than 1 hour.
EIA-RS-364-31A
Salt Spray
Contact resistance:
100mΩ Max(Finally).
The specimens shall be subjected to a salt
water spray (concentration : 5±1%) at a
temperature of 35±2℃ for 24 hours, then
placed in ambient temperature for more
than 1 hour.
EIA-RS-364-26A
SOLDER ABILITY
Item
Requirement
Test Condition
Solder ability
1. Appearance: No
evidence of
Physical damage.
2. More than 95%
of the solder able
area shall be
covered with
solder.
After 5~10 seconds flux deep. Subject
connector lead to solder bath at 235°C±3°C
for 5±0.5 seconds.
MIL-STD-202F, Method 208
Resistance to
Soldering heat
No evidence of
Physical damage.
The connector shall be tested resistance. To
soldering heat in the following conditions.
For RoHS 260℃ 10±0.5 seconds.



Html Pages

1 2 3 4 5 6 7


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com