SPECIFICATION AND PERFORMANCE

SERIES:

DDR Series

FILE:

DDR Series_spec

DATE:

2013/01/04

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.

本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-4 -

Cold Resistance

Detrimental damage

affecting to the

performance shall not

occur.

Solder connectors on PCB and mate them

together, expose to -40±3℃ for 96hours.

Upon completion of the exposure period,

the test specimens shall be conditioned at

ambient room conditions for 1 to 2 hours,

after which the specified measurements

shall be performed.

Thermal Shock

Detrimental damage

affecting to the

performance shall not

occur.

Solder connectors on PCB and mate them

together, subject to the following

conditions for 5 cycles.

Upon completion of the exposure period,

the test specimens shall be conditioned at

ambient room conditions for 1 of 2 hours,

after which the specified measurements

shall be performed.

Heat Cycle:

a) –40℃ (30min.)

b ) +85℃ (30min.)

Transit time shall be within 3 min

Humidity

Detrimental damage

affecting to the

performance shall not

occur.

Solder connectors on PCB and mate them

together, expose to the defined

environment condition for 10 cycles.

Upon completion of the exposure period,

the test specimens shall be conditioned at

ambient room condition s for 1 of 2 hours,

after which the specified measurements

shall be performed.