Nexperia

PESD3V3HS2-SF

Very low clamping bidirectional ESD protection diode

12. Soldering

SOD962-2

Footprint information for reflow soldering of leadless ultra small package; 2 terminals

sod962-2_fr

occupied area

solder paste

solder lands

Issue date

Dimensions in mm

16-02-01

20-09-15

0.4

0.2

0.6

0.2

0.85

0.2

0.28

0.16

0.256

0.256

0.4

recommended stencil thickness: 0.1 mm

Fig. 7. Reflow soldering footprint for DSN0603-2 (SOD962-2)

PESD3V3HS2-SF

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Product data sheet

11 August 2022

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