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µPD4704

RECOMMENDED SOLDERING CONDITIONS

The following conditions (see table below) must be met when soldering this product.

Please consult with our sales offices in case other soldering process is used, or in case soldering is done under

different conditions.

TYPES OF SURFACE MOUNT DEVICE

For more details, refer to our document “Semiconductor Device Mounting Technology Manual” (IEI-1207).

µPD4704G

Soldering process

Soldering conditions

Symbol

Infrared ray reflow

Peak package’s surface temperature: 235

°C or below,

IR35-00-2

Reflow time: 30 seconds or below (210

°C or higher),

Number of reflow process: 2, Exposure limit*: None

VPS

Peak package’s surface temperature: 215

°C or below,

VP15-00-2

Reflow time: 40 seconds or below (200

°C or higher),

Number of reflow process: 2, Exposure limit*: None

Wave soldering

Solder temperature: 260

°C or below,

WS60-00-1

Flow time: 10 seconds or below,

Number of flow process: 1, Exposure limit*: None

Partial heating method

Terminal temperature: 300

°C or below,

q

q

Flow time: 10 seconds or below,

Exposure limit*: None

*

Exposure limit before soldering after dry-pack package is opened.

Storage conditions: 25

°C and relative humidity at 65 % or less.

Note Do not apply more than a single process at once, except for “Partial heating method”.

TYPES OF THROUGH HOLE MOUNT DEVICE

µPD4704C

Soldering process

Soldering conditions

Symbol

Wave soldering

Solder temperature: 260

°C or below,

Flow time: 10 seconds or below

REFERENCE

Dcodument name

Document No.

NEC semiconductor device reliability/quality control system

IEI-1212

Quality grade on NEC semiconductor devices

IEI-1209

Semiconductor device mounting technology manual

IEI-1207

Semiconductor device package manual

IEI-1213

Guide to quality assurance for semiconductor devices

MEI-1202

Semiconductor selection guide

MF-1134