MCP16311SLASH2 datasheet(11/40 Pages) MICROCHIP

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DS20005255C-page 11

MCP16311/2

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

3.1

Feedback Voltage Pin (VFB)

The VFB pin is used to provide output voltage regulation

by using a resistor divider. The VFB voltage will be

0.800V typical with the output voltage in regulation.

3.2

Internal Bias Pin (VCC)

The VCC internal bias is derived from the input voltage

VIN. VCC is set to 5.0V typical. The VCC is used to

provide a stable low bias voltage for the upper and

lower gate drive circuits. This output should be

decoupled to AGND with a 1 µF capacitor, X7R. This

capacitor should be connected as close as possible to

the VCC and AGND pin.

3.3

Enable Pin (EN)

The EN pin is a logic-level input used to enable or

disable the device and lower the quiescent current

while disabled. A logic high (> 1.3V) will enable the

regulator output. A logic low (< 1V) will ensure that the

regulator is disabled.

3.4

Power Supply Input Voltage Pin

(VIN)

Connect the input voltage source to VIN. The input

source should be decoupled to GND with a

4.7 µF-20 µF capacitor, depending on the impedance

of the source and output current. The input capacitor

provides current for the switch node and a stable

voltage source for the internal device power. This

capacitor should be connected as close as possible to

the VIN and GND pins. For light-load applications, a

2.2 µF X7R or X5R ceramic capacitor can be used.

3.5

Analog Ground Pin (AGND)

This ground is used by most internal circuits, such as

the analog reference, control loop and other circuits.

3.6

Power Ground Pin (PGND)

This is a separate ground connection used for the low-

side synchronous switch.The length of the trace from

the input cap return, output cap return and GND pin

should be made as short as possible to minimize the

noise in the system. The power ground and the analog

ground should be connected in a single point.

3.7

Switch Node Pin (SW)

The switch node pin is connected internally to the low-

side and high-side switch, and externally to the SW

node, consisting of the inductor and boost capacitor.

The SW node can rise very fast as a result of the

internal switch turning on.

3.8

Boost Pin (BOOST)

The high side of the floating supply used to turn the

integrated N-Channel high-side MOSFET on and off is

connected to the boost pin.

3.9

Exposed Thermal Pad Pin (EP)

There is an internal electrical connection between the

EP and the PGND and AGND pins.

TABLE 3-1:

PIN FUNCTION TABLE

MCP16311/2

2x 3 TDFN

MCP16311/2

MSOP

Symbol

Description

VFB

Output Voltage Feedback pin. Connect VFB to an external resistor

divider to set the output voltage.

VCC

Internal Regulator Output pin. Bypass Capacitor is required on this

pin to provide high peak current for gate drive.

Enable pin. Logic high enables the operation. Do not allow this pin to

float.

VIN

Input Supply Voltage pin for power and internal biasing

PGND

Power Ground pin

Output Switch Node pin, connects to the inductor and the bootstrap

capacitor

BOOST

Boost Voltage pin that supplies the driver used to control the high-

side NMOS switch. A bootstrap capacitor is connected between the

BOOST and SW pins.

AGND

Signal Ground pin

—

Exposed thermal pad

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