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PMDPB85UPE Datasheet(PDF) 4 Page - Nexperia B.V. All rights reserved |
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PMDPB85UPE Datasheet(HTML) 4 Page - Nexperia B.V. All rights reserved |
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4 / 15 page ![]() © Nexperia B.V. 2017. All rights reserved PMDPB85UPE All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 20 June 2012 4 of 15 Nexperia PMDPB85UPE 20 V dual P-channel Trench MOSFET 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm2. IDM = single pulse Fig 3. Safe operating area; junction to ambient; continuous and peak drain currents as a function of drain-source voltage aaa-003928 -1 -10-1 -10 -102 ID (A) -10-2 VDS (V) -10-1 -102 -10 -1 tp = 100 μs tp = 1 ms tp = 10 ms tp = 100 ms Limit RDSon = VDS/ID DC; Tsp = 25 °C DC; Tamb = 25 °C; drain mounting pad 6 cm2 Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per transistor Rth(j-a) thermal resistance from junction to ambient in free air [1] - 211 243 K/W [2] - 93 107 K/W in free air; t ≤ 5 s [2] - 5564K/W Rth(j-sp) thermal resistance from junction to solder point - 1215K/W |
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