Nexperia

PSMN1R3-80SSF

NextPower 80 V, 1.3 mOhm, 325 Amp, N-channel MOSFET in LFPAK88 package

11. Soldering

SOT1235

Footprint information for reflow soldering of LFPAK88 package

sot1235_fr

Issue date 18-12-12

18-12-13

occupied area

1.25

0.2

0.2

0.1

1.15

1.3

1.4

1.6

1.76

5.7

3.74

9.4

6.55

6.8

7

0.7

4.275

7.8

1.6

1.225

1.9

2.925

1.85

2.05

1.7

1.2

2.1

8.6

0.3

0.2

0.2

0.7

8.8

9.2

solder land

solder resist

solder paste

Dimensions in mm

1.2

1.4

7.8

recommended stencil thickness: 0.125 mm

1.1

2

Fig. 8. Reflow soldering footprint for LFPAK88 (SOT1235)

PSMN1R3-80SSF

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© Nexperia B.V. 2023. All rights reserved

Objective data sheet

21 June 2023

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