RT6160A

Copyright © 2023 Richtek Technology Corporation. All rights reserved.

is a registered trademark of Richtek Technology Corporation.

DS6160A-02

July 2023

www.richtek.com

9

Parameter

Symbol

Test Conditions

Min

Typ

Max Unit

Set-Up Time for a Repeated

START Condition

tSU;STA

Standard mode

4.7

--

--

s

Fast mode

0.6

--

--

Fast mode plus

0.26

--

--

Data Hold Time

tHD;DAT

Standard mode

0.1

--

--

ns

Fast mode

0.1

--

--

Fast mode plus

0.1

--

--

Set-Up Time for STOP

Condition

tSU;STO

Standard mode

4

--

--

s

Fast mode

0.6

--

--

Fast mode plus

0.26

--

--

Data Valid Acknowledge

Time

tVD;ACK

Standard mode

--

--

3.45

s

Fast mode

--

--

0.9

Fast mode plus

--

--

0.45

SDA Set-Up Time

tSU;DAT

Standard mode

250

--

--

ns

Fast mode

100

--

--

Fast mode plus

50

--

--

Low Period of the SCL Clock tLOW

Standard mode

4.7

--

--

s

Fast mode

1.3

--

--

Fast mode plus

0.5

--

--

High Period of the SCL Clock tHIGH

Standard mode

4

--

--

s

Fast mode

0.6

--

--

Fast mode plus

0.26

--

--

Note 1.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These

are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in

the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect

device reliability.

Note 2.

JA is measured under natural convection (still air) at TA = 25°C with the component mounted on a high effective-thermal-

conductivity four-layer test board on a JEDEC 51-7 thermal measurement standard.

Note 3.

Devices are ESD sensitive. Handling precautions are recommended.

Note 4.

The device is not guaranteed to function outside its operating conditions.

Note 5.

Effective capacitance after DC bias effects have been considered.

Note 6.

Guaranteed by design.

Note 7.

The device can sustain the maximum recommended output current, Users must verify that the thermal performance of

the end application can support the maximum output current.