AD8332ACP-R2 datasheet(39/40 Pages) AD

39 / 40 page

AD8331/AD8332/AD8334

Rev. E | Page 39 of 40

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-153-AE

8°

0°

SEATING

PLANE

COPLANARITY

0.10

1.20 MAX

6.40 BSC

0.65

BSC

PIN 1

0.30

0.19

0.20

0.09

4.50

4.40

4.30

0.75

0.60

0.45

9.80

9.70

9.60

0.15

0.05

Figure 95. 28-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-28)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-137-AD

PIN 1

8°

0°

0.010

0.004

0.012

0.008

0.025

BSC

COPLANARITY

0.004

0.065

0.049

0.069

0.053

SEATING

PLANE

0.010

0.006

0.050

0.016

0.345

0.341

0.337

0.158

0.154

0.150

0.244

0.236

0.228

Figure 96. 20-Lead Shrink Small Outline Package [QSOP]

(RQ-20)

Dimensions shown in Inches

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

0.30

0.23

0.18

0.20 REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

12° MAX

1.00

0.85

0.80

SEATING

PLANE

COPLANARITY

0.08

0.50

0.40

0.30

3.50 REF

0.50

BSC

PIN 1

INDICATOR

TOP

VIEW

5.00

BSC SQ

4.75

BSC SQ

3.25

3.10 SQ

2.95

PIN 1

INDICATOR

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

THE EXPOSE PAD IS NOT CONNECTED

INTERNALLY. FOR INCREASED RELIABILITY

OF THE SOLDER JOINTS AND MAXIMUM

THERMAL CAPABILITY IT IS RECOMMENDED

THAT THE PAD BE SOLDERED TO

THE GROUND PLANE.

Figure 97. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-2)

Dimensions shown in millimeters

AD8332ACP-R2 Datasheet(PDF) 39 Page - Analog Devices

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