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ADRF5700BCCZN-R7 Datasheet(PDF) 15 Page - Analog Devices

Part # ADRF5700BCCZN-R7
Description  46 dB, 2 dB LSB, 5-Bit, Silicon Digital Attenuator, 100 MHz to 22 GHz
PDF  16 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADRF5700BCCZN-R7 Datasheet(HTML) 15 Page - Analog Devices

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Data Sheet
ADRF5700
APPLICATIONS INFORMATION
analog.com
Rev. 0 | 15 of 16
The ADRF5700 has two power supply pins (VDD and VSS) and six
control pins (LE, D2, D3, D4, D5, and D6). Figure 25 shows the
external components and connections for supply and control pins.
The VDD pin and the VSS pin are decoupled with a 100 pF multi-
layer ceramic capacitor. The device pinout allows the placement of
the decoupling capacitors close to the device. No other external
components are needed for bias and operation, except DC blocking
capacitors on the RFx pins when the RF lines are biased at a
voltage other than 0 V. For more details, see the Pin Configuration
and Function Descriptions section.
Figure 25. Recommended Schematic
RECOMMENDATIONS FOR PCB DESIGN
The RF ports are matched to 50 Ω internally, and the pinout
is designed to mate a coplanar waveguide (CPWG) with a 50
Ω characteristic impedance on the PCB. Figure 26 shows the
referenced CPWG RF trace design for an RF substrate with 12 mil
thick Rogers RO4003 dielectric material. The RF trace with a 16 mil
width and a 6 mil clearance is recommended for 2.2 mil finished
copper thickness.
Figure 26. Example PCB Stackup
Figure 27 shows the routing of the RF traces, supply, and control
signals from the device. The ground planes are connected with as
many filled through vias as allowed for optimal RF and thermal
performance. The primary thermal path for the device is the bottom
side.
Figure 27. PCB Routings
Figure 28 shows the recommended layout from the device RFx
pins to the 50 Ω CPWG on the referenced stackup. PCB pads are
drawn 1:1 to device pads. The ground pads are drawn solder mask
defined, and the signal pads are drawn as pad defined. The RF
trace from the PCB pad is extended with the same width up to the
package edge and tapered to the RF trace with a 45° angle. The
paste mask is also designed to match the pad without any aperture
reduction and is divided into multiple openings for the paddle.
Figure 28. Recommended RF Pin Transitions
For alternate PCB stackups with different dielectric thickness and
CPWG design, contact Technical Support for further recommenda-
tions.



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