Specifications of the HT1 MOA3 S30

Rev. 1.1

1997-08-19

Ht1moa3.doc/HS

Page 2 of 24

Table of Contents

1 Definitions .............................................................................................................................. 3

1.1 Objective of the Specifications ..................................................................................................................... 3

1.2 Definition of the Chip Module ..................................................................................................................... 3

1.3 Use of the Modules ...................................................................................................................................... 3

2 Specifications ......................................................................................................................... 4

2.1 Mechanical Properties ................................................................................................................................. 4

2.2 Materials ..................................................................................................................................................... 4

2.3 Temperature Range ..................................................................................................................................... 4

2.4 Storage Conditions ...................................................................................................................................... 5

2.5 Delivery Conditions ..................................................................................................................................... 5

2.6 Electrical Specifications............................................................................................................................... 6

3 Drawing of the Chip Module HT1 MOA3 S30..................................................................... 7

3.1 Drawing of the Reel..................................................................................................................................... 7

3.2 Module outline suggestion ........................................................................................................................... 8

3.3 Splicing Specification .................................................................................................................................. 9

4 Coil Specifications................................................................................................................ 10

5 Functional Description of HITAG 1 ................................................................................... 12

5.1 Memory Organization................................................................................................................................ 12

5.2 Anticollision.............................................................................................................................................. 13

5.3 Operation Modes and Configuration .......................................................................................................... 14

5.3.1 Modes of Operation............................................................................................................................ 14

5.3.2 Configuration..................................................................................................................................... 14

5.4 Configuration of Delivered HITAG 1 Transponders................................................................................... 17

5.5 Definition of Keys and Logdata ................................................................................................................. 17

6 Quality Inspection ............................................................................................................... 19

7 Characterisation and Test of the Final Transponder ......................................................... 20

7.1 Characterisation of the Transponder .......................................................................................................... 20

7.2 Final Test of the Transponder .................................................................................................................... 20

8 Ordering Information.......................................................................................................... 21

HITAG