LXXLD70

Preliminary

CMOS IC

UNISONICTECHNOLOGIESCO.,LTD

4 of 8

www.unisonic.com.tw

QW-R502-674.e



ABSOLUTE MAXIMUM RATING

PARAMETER

SYMBOL

RATINGS

UNIT

Supply Voltage (VCNTL to GND)

VCNTL

-0.3 ~ +7

V

Supply Voltage (VIN to GND)

VIN

-0.3 ~ +3.9

V

EN and FB to GND

VI/O

-0.3 ~ VCNTL+0.3

V

POK to GND Voltage

VPOK

-0.3 ~ +7

V

Power Dissipation

PD

3

W

Lead Soldering Temperature, 10 Seconds

TSDR

260

°С

Junction Temperature

TJ

+150

°С

Storage Temperature

TSTG

-65 ~ +150

°С

Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.

Absolute maximum ratings are stress ratings only and functional device operation is not implied.



RECOMMENDED OPERATING CONDITIONS

PARAMETER

SYMBOL

RATINGS

UNIT

VCNTL Supply Voltage

VCNTL

4.5 ~ 6

V

VIN Supply Voltage

VIN

1.0 ~ 3.5

V

Output Voltage , VCNTL=5.0±5%

VOUT

0.8 ~ VIN-0.2

V

Output Current

IOUT

0 ~ 7

A

Junction Temperature

TJ

+125

°С



THERMAL DATA

PARAMETER

SYMBOL

RATINGS

UNIT

Junction to Ambient in Free Air (Note 1)

θJA

38

°C/W

Junction to Case (Note 2)

θJC

14

°C/W

Notes: 1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.

The exposed pad of HSOP-8 is soldered directly on the PCB.

2. The Thermal Pad Temperature is measured on the PCB copper area connected to the thermal pad of

package.