AM29LV160BT-70REF datasheet(53/54 Pages) AMD

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Am29LV160B

REVISION SUMMARY

Revision F (January 1998)

Distinctive Characteristics

Changed typical read and program/erase current

specifications.

Device now has a guaranteed minimum endurance of

1,000,000 write cycles.

Figure 2, In-System Sector Protect/Unprotect

Algorithms

Corrected A6 to 0, Changed wait specification to 150

s on sector protect and 15 ms on sector unprotect.

DC Characteristics

Changed typical read and program/erase current

specifications.

AC Characteristics

Alternate CE# Controlled Erase/Program Operations:

Changed tCP to 35 ns for 70R, 80, and 90 speed

options.2w

Erase and Programming Performance

Device now has a guaranteed minimum endurance of

1,000,000 write cycles.

Physical Dimensions

Corrected dimensions for package length and width in

FBGA illustration (standalone data sheet version).

Revision F+1

Table 9, Command Definitions

Corrected the byte-mode address in the sixth write

cycle of the chip erase command sequence to AAAh.

Revision F+2

Figure 2, In-System Sector Protect/Unprotect

Algorithms

In the sector protect algorithm, added a “Reset

PLSCNT=1” box in the path from “Protect another sec-

tor?” back to setting up the next sector address.

DC Characteristics

Changed ICC1 test conditions and Note 1 to indicate

that OE# is at VIH for the listed current.

AC Characteristics

Erase/Program Operations; Alternate CE# Controlled

Erase/Program Operations: Corrected the notes refer-

ence for tWHWH1 and tWHWH2. These parameters are

100% tested. Corrected the note reference for tVCS.

This parameter is not 100% tested.

Temporary Sector Unprotect Table

Added note reference for tVIDR. This parameter is not

100% tested.

Figure 22, Sector Protect/Unprotect Timing

Diagram

A valid address is not required for the first write cycle;

only the data 60h.

Erase and Programming Performance

In Note 2, the worst case endurance is now 1 million

cycles.

Revision G (January 1999)

Global

Added 70R speed option, changed 80R speed option

to 80.

Distinctive Characteristics

Changed process technology to 0.32 µm.

DC Characteristics

Moved VCCmax test condition for ICC specifications

to notes.

Connection Diagrams

Corrected the reverse TSOP drawing to show orienta-

tion and pin 1 indicators.

Distinctive Characteristics

Added 20-year data retention bullet.

Connection Diagrams

Updated FBGA figure.

Ordering Information

Changed FBGA package reference to FBC048; ad-

dded FBGA package marking information.

Physical Dimensions

Changed drawing to FBC048.

Revision G+1 (February 1999)

Connection Diagrams

FBGA: Corrected to indicate that diagram shows the

top view, balls facing down.

Command Definitions Table

Corrected the address in the sixth cycle of the chip

erase sequence to AAAh.

Revision H (November 23, 1999)

AC Characteristics—Figure 17. Program Opera-

tions Timing and Figure 18. Chip/Sector Erase

Operations

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