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AM29LV160M Datasheet(PDF) 13 Page - Advanced Micro Devices

Part # AM29LV160M
Description  16 Megabit (2 M x 8-Bit/1 M x 16-Bit) MirrorBit TM 3.0 Volt-only Boot Sector Flash Memory
PDF  63 Pages
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Manufacturer  AMD [Advanced Micro Devices]
Direct Link  http://www.amd.com
Logo AMD - Advanced Micro Devices

AM29LV160M Datasheet(HTML) 13 Page - Advanced Micro Devices

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January 31, 2007 25974B5
Am29LV160M
11
Data
Sheet
The internal state machine is set for reading array data upon device power-up,
or after a hardware reset. This ensures that no spurious alteration of the mem-
ory content occurs during the power transition. No command is necessary in
this mode to obtain array data. Standard microprocessor read cycles that as-
sert valid addresses on the device address inputs produce valid data on the
device data outputs. The device remains enabled for read access until the com-
mand register contents are altered.
See “Reading Array Data” on page 23 for more information. Refer to the table
“Read Operations” on page 42 for timing specifications and to Figure 13, on page
42 for the timing diagram. ICC1 in the table “CMOS Compatible” on page 40 rep-
resents the active current specification for reading array data.
Writing Commands/Command Sequences
To write a command or command sequence (which includes programming data
to the device and erasing sectors of memory), the system must drive WE# and
CE# to VIL, and OE# to VIH.
For program operations, the BYTE# pin determines whether the device accepts
program data in bytes or words. Refer to “Word/Byte Configuration” on page 10
for more information.
The device features an Unlock Bypass mode to facilitate faster programming.
Once the device enters the Unlock Bypass mode, only two write cycles are re-
quired to program a word or byte, instead of four. The “Word/Byte Program
Command Sequence” on page 24 contains details on programming data to the
device using both standard and Unlock Bypass command sequences.
An erase operation can erase one sector, multiple sectors, or the entire device.
Table 2, on page 13 and Table 3, on page 14 indicate the address space that each
sector occupies. A “sector address” consists of the address bits required to
uniquely select a sector. The sector “Command Definitions” on page 23 contains
details on erasing a sector or the entire chip, or suspending/resuming the erase
operation.
After the system writes the autoselect command sequence, the device enters the
autoselect mode. The system can then read autoselect codes from the internal
register (which is separate from the memory array) on DQ7–DQ0. Standard read
cycle timings apply in this mode. Refer to the sections “Autoselect Mode” on
page 15 and “Autoselect Command Sequence” on page 24 for more information.
ICC2 in the DC Characteristics table represents the active current specification for
the write mode. The section “AC Characteristics” on page 42 contains timing
specification tables and timing diagrams for write operations.
Program and Erase Operation Status
During an erase or program operation, the system may check the status of the
operation by reading the status bits on DQ7–DQ0. Standard read cycle timings
and ICC read specifications apply. Refer to “Write Operation Status” on page 33
for more information, and to “AC Characteristics” on page 42 for timing diagrams.
Standby Mode
When the system is not reading or writing to the device, it can place the device
in the standby mode. In this mode, current consumption is greatly reduced, and
the outputs are placed in the high impedance state, independent of the OE#
input.



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