June 11, 2002

Am29F016D Known Good Die

9

SU P P L E MEN T

PHYSICAL SPECIFICATIONS

Die Dimensions, X x Y . . . . 186.61 mils x 208.66 mils

. . . . . . . . . . . . . . . . . . . . . . . . . . . 4.74 mm x 5.30 mm

Die Thickness . . . . . . . . . . . . . . . . . . . . . . . . ~20 mils

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500 µm

Bond Pad Size . . . . . . . . . . . . . . 3.52 mils x 3.52 mils

. . . . . . . . . . . . . . . . . . . . . . . . . . . . 89.3 µm x 89.3 µm

Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38

Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Cu/Si

Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,

may be grounded (optional)

Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride

DC OPERATING CONDITIONS

Operating Temperature

Commercial . . . . . . . . . . . . . . . . . . . 0

°C to +70°C

Industrial . . . . . . . . . . . . . . . . . . . –40

°C to +85°C

MANUFACTURING INFORMATION

Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . FASL

Wafer Sort Test . . . . . . . . . . . . . . . . . . Sunnyvale, CA

. . . . . . . . . . . . . . . . . . . . . . . . and Penang, Malaysia

Manufacturing ID . . . . . . . . . . . . . . . . . . . . . 98J32AK

Preparation for Shipment . . . . . . . . Penang, Malaysia

Fabrication Process . . . . . . . . . . . . . . . . . . . CS49HS

Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

SPECIAL HANDLING INSTRUCTIONS

Processing

Do not expose KGD products to ultraviolet light or

process them at temperatures greater than 250

°C.

Failure to adhere to these handling instructions will

result in irreparable damage to the devices. For best

yield, AMD recommends assembly in a Class 10K

clean room with 30% to 60% relative humidity.

Storage

Store at a maximum temperature of 30

°C in a nitrogen-

purged cabinet or vacuum-sealed bag. Observe all

standard ESD handling procedures.