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FXPS7115D4S Datasheet(PDF) 59 Page - NXP Semiconductors |
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FXPS7115D4S Datasheet(HTML) 59 Page - NXP Semiconductors |
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59 / 72 page  NXP Semiconductors FXPS7115D4S Digital absolute pressure sensor, 40 kPa to 115 kPa The sensor can be configured to operate in SPI mode to read the user registers, self-test and diagnostics information. The application diagram in Figure 26 shows the SPI and the respective biasing and bypass components. Note: A gel is used to provide media protection against corrosive elements which may otherwise damage metal bond wires and/or IC surfaces. Highly pressurized gas molecules may permeate through the gel and then occupy boundaries between material surfaces within the sensor package. When decompression occurs, the gas molecules may collect, form bubbles and possibly result in delamination of the gel from the material it protects. If a bubble is located on the pressure transducer surface or on the bond wires, the sensor measurement may shift from its calibrated transfer function. In some cases, these temporary shifts could be outside the tolerances listed in the data sheet. In rare cases, the bubble may bend the bond wires and result in a permanent shift. aaa-029732 VCC VCC VCC VCC SS INT FXPS7xxxD4 SCL SDA VSS C1 VCCIO R1 R2 R3 Figure 25. I2C application diagram of FXPS7115D4S Name Type Description Purpose C1 Ceramic 0.1 μF, 10 %, 10 V minimum, X7R VCC power supply decoupling R1 General purpose 1000 Ω, 5 %, 200 PPM I2C selection pin pull-up resistor R2 General purpose 1000 Ω, 5 %, 200 PPM Serial clock pull-up resistor R3 General purpose 1000 Ω, 5 %, 200 PPM Serial data pull-up resistor Table 106. External component recommendations for I2C aaa-029733 VCC VCC INT VSS C1 VCCIO MOSI FXPS7xxxD4 SCLK MISO SS_B Figure 26. SPI application diagram for FXPS7115D4S Name Type Description Purpose C1 Ceramic 0.1 μF, 10 %, 10 V minimum, X7R VCC power supply decoupling Table 107. External component recommendations for SPI FXPS7115D4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved. Product data sheet Rev. 1.4 — 3 November 2023 59 / 72 |
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