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PCA82C251 Datasheet(PDF) 5 Page - NXP Semiconductors |
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PCA82C251 Datasheet(HTML) 5 Page - NXP Semiconductors |
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5 / 20 page ![]() 2000 Jan 13 5 Philips Semiconductors Product specification CAN transceiver for 24 V systems PCA82C251 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to pin 2; positive input current. Notes 1. TXD is LOW. Short-circuit protection provided for slew rates up to 5 V/ µs for voltages above +30 V. 2. Short-circuit applied when TXD is HIGH, followed by TXD switched to LOW. 3. In accordance with “IEC 60747-1”. An alternative definition of virtual junction temperature is: Tvj =Tamb +Pd × Rth(vj-a), where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (Pd) and ambient temperature (Tamb). 4. Classification A: human body model; C = 100 pF; R = 1500 Ω; V = ±2500 V. 5. Classification B: machine model; C = 200 pF; R = 0 Ω; V = ±250 V. THERMAL CHARACTERISTICS QUALITY SPECIFICATION According to “SNW-FQ-611 part E”. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage −0.3 +7.0 V Vn DC voltage at pins 1, 4, 5 and 8 −0.3 VCC + 0.3 V V6 DC voltage at pin 6 (CANL) 0V<VCC < 5.5 V; TXD HIGH or floating −36 +36 V 0V<VCC < 5.5 V; no time limit; note 1 −36 +36 V 0V<VCC < 5.5 V; no time limit; note 2 −36 +36 V V7 DC voltage at pin 7 (CANH) 0V<VCC < 5.5 V; no time limit −36 +36 V Vtr transient voltage on pins 6 and 7 see Fig.8 −200 +200 V Tstg storage temperature −55 +150 °C Tamb ambient temperature −40 +125 °C Tvj virtual junction temperature note 3 −40 +150 °C Vesd electrostatic discharge voltage note 4 −2500 +2500 V note 5 −250 +250 V SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-a) thermal resistance from junction to ambient in free air PCA82C251 100 K/W PCA82C251T 160 K/W |
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