1999 Apr 12

23

Philips Semiconductors

Product specification

48

× 84 pixels matrix LCD controller/driver

PCD8544

The pinning is optimized for single plane wiring e.g. for chip-on-glass display modules. Display size: 48

× 84 pixels.

11

100000100

data write

12

100011111

data write

13

000001101

display control; set

inverse video mode

(D=1andE=1)

14

010000000

set X address of RAM;

set address to ‘0000000’

15

100000000

data write

STEP

SERIAL BUS BYTE

DISPLAY

OPERATION

D/C

DB7

DB6

DB5

DB4

DB3

DB2

DB1

DB0

MGL677

MGL678

MGL679

MGL679

MGL680

Fig.17 Application diagram.

handbook, halfpage

MGL635

DISPLAY 48

× 84 pixels

PCD8544

I/O

VDD VSS VLCD

Cext

8

84

24

24

The required minimum value for the external capacitors is:

Higher capacitor values are recommended for ripple

reduction.

14 BONDING PAD LOCATIONS

14.1

Bonding pad information (see Fig.18)

PARAMETER

SIZE

Pad pitch

min. 100

µm

Pad size, aluminium

80

× 100 µm

Bump dimensions

59

× 89 × 17.5 (±5) µm

Wafer thickness

max. 380

µm