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PCF8531 Datasheet(PDF) 39 Page - NXP Semiconductors |
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PCF8531 Datasheet(HTML) 39 Page - NXP Semiconductors |
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39 / 44 page  2000 Feb 11 39 Philips Semiconductors Product specification 34 × 128 pixel matrix driver PCF8531 17 TRAY INFORMATION handbook, full pagewidth MGS488 D C A x y F E B Fig.30 Tray details. The dimensions are given in Table 13. Table 13 Dimensions handbook, halfpage MGS489 Fig.31 Tray alignment. The orientation of the IC in a pocket is indicated by the position of the IC type name on the die surface with respect to the chamfer on the upper left corner of the tray. Refer to the bonding pad location diagram for the orientating and position of the type name on the die surface. DIM. DESCRIPTION VALUE A pocket pitch; x direction 13.72 mm B pocket pitch; y direction 4.17 mm C pocket width; x direction 12.34 mm D pocket width; y direction 2.05 mm E tray width; x direction 50.8 mm F tray width; y direction 50.8 mm x number of pockets in x direction 3 y number of pockets in y direction 10 |
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