ZXMP6A13F

ISSUE 3 - MAY 2007

2

PARAMETER

SYMBOL

VALUE

UNIT

Junction to Ambient

(a)

200

°C/W

Junction to Ambient

(b)

155

°C/W

NOTES

(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions

(b) For a device surface mounted on FR4 PCB measured at t

≤5 secs.

(c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.05 pulse width=10µs - pulse width limited by maximum junction temperature.

THERMAL RESISTANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-Source Voltage

-60

V

Gate Source Voltage

20

V

(b)

(b)

(a)

-1.1

-0.8

-0.9

A

Pulsed Drain Current

(c)

-4.0

A

Continuous Source Current (Body Diode)

(b)

-1.2

A

Pulsed Source Current (Body Diode)

(c)

-4.0

A

(a)

Linear Derating Factor

625

5

mW

mW/°C

(b)

Linear Derating Factor

806

6.5

mW

mW/°C

Operating and Storage Temperature Range

-55 to +150

°C

ABSOLUTE MAXIMUM RATINGS.